Sealed: .9-1.5 cubic feet
Ported: 1.25 -1.75 cubic feet
Power Handling: 400W
Impedance Dual 4 Ohm
Xmax 0.65" /16.5mm
W6v2 Subwoofer Drivers
What if the compromises inherent in speaker design could be negotiated to create exceptional sound quality and output in very compact enclosures?

What if you could apply years of intense research and vast experience in subwoofer driver design to such a project?


What if the freedom existed to engineer every component of the new design from the ground up?

You are looking at our answer to these questions, the W6v2 drivers.

At first glance, youre likely to notice the striking cast alloy frame design. These frames are much more than cosmetic enhancements, having been specifically engineered to provide increased clearance for greater excursion and to incorporate our patented Elevated Frame-Cooling technology. This cooling scheme directs high-velocity air flow over the top surface of the top-plate and onto the upper portion of the voice coil windings (the two hottest parts on a woofer). For style points, the mounting flange of the frame is dressed with a removable black trim ring (Patented) which can be painted to match the theme of the installation.

Like the W7s, the W6v2 subwoofers benefit from JL AUDIOs proprietary Dynamic Motor Analysis system (DMA). This advanced technology allows us to optimize motor behavior, while taking into account the effects of real power flowing across the voice coil. The result is dynamically stable and linear motor behavior, which translates directly into reduced distortion and improved transient performance.
The diaphragm design also relies on W7 technology, utilizing our W-Cone (Patented) design and Floating Cone Attach Method (Patented). This results in a lightweight, stiff and critically aligned moving assembly (again enhancing sound quality). The diaphragm also incorporates a new (Patent-Pending) NeckVent design to enhance cooling performance.

Co-extruded, insulated lead wires lead to a configurable patch panel which makes it easier and cleaner to interconnect the dual voice coil windings. A single pair of high-grade push terminals acts as a main input connection.

All this technology comes together to deliver subwoofers that excel in thermal power handling, linear excursion capability and dynamic stability; all of which contribute to the original goals: The ability to have amazing low-frequency extension in compact enclosures, razor sharp definition of complex bass material and audiophile sound quality at any volume level...

...in other words, the balance of power and finesse.